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W.C. Shen, P.J. Shih, Y.C. Tsai, C.C. Hsu, C.L. Dai*, Low-concentration ammonia gas sensors manufactured using the CMOS–MEMS technique, Micromachines, Vol. 11, pp. 92, 2020. (SCI, IF=2.426, Rank=25/61)
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W.L. Lee, P.J. Shih, C.C. Hsu, C.L. Dai*, Fabrication and characterization of flexible thermoelectric generators using micromachining and electroplating techniques, Micromachines, Vol. 10, pp. 660, 2019. (SCI, IF=2.426, Rank=25/61)
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Y.N. Lin, C.L. Dai*, Micro magnetic field sensors manufactured using a standard 0.18 m CMOS process, Micromachines, Vol. 9, pp. 393, 2018. (SCI, IF=2.222, Rank=22/61)
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Y.W. Chen, C.C. Wu, C.C. Hsu, C.L. Dai*, Fabrication and testing of thermoelectric CMOS-MEMS microgenerators with CNCs film, Applied Sciences, Vol. 8, pp. 1047, 2018. (SCI, IF=1.689, Rank=77/146)
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C.Y. Chen, C.C. Hsu, C.C. Wu, C.L. Dai, Sodium chloride concentration measurement by using doping/un-doping poly-silicon nanowire device, International Journal of Materials Science and Engineering, Vol. 6, pp. 18-22, 2018.
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J.Z. Tseng, P.J. Shih, C.C. Hsu, C.L. Dai*, A three-axis magnetic field microsensor fabricated utilizing a CMOS process, Applied Sciences, Vol. 7, pp. 1289, 2017. (SCI, IF=1.689, Rank=77/146)
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H.J. Shih, C.L. Dai, P.J. Shih, Tip pressure on semicircular specimens in tapping mode atomic force microscopy in viscous fluid environments, Sensors, Vo. 17, pp. 2182, 2017. (SCI, IF=2.475, Rank=16/61)
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C.Y Lin, C.C. Hsu, C.L. Dai*, “Fabrication of a micromachined capacitive switch using the CMOS-MEMS technology”, Micromachines, Vol. 6, pp. 1645-1654, 2015. (SCI, IF=1.269, Rank= 30/56)
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C.F. Fong, C.L. Dai*, C.C. Wu, “Fabrication and characterization of a micro methanol sensor using the CMOS-MEMS technique,” Sensors, Vol. 15, pp. 27047-27059, 2015. (SCI, IF= 2.245, Rank=10/56)
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M.Z. Yang, C.L. Dai*, “Ethanol microsensors with a readout circuit manufactured using the CMOS-MEMS technique, Sensors, Vol. 15, pp. 1623-1634, 2015. (SCI, IF= 2.245, Rank=10/56)
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S.W. Peng, P.J. Shih, C.L. Dai*, “Manufacturing and characterization of a thermoelectric energy harvester using the CMOS-MEMS technology,” Micromachines, Vol. 6, pp. 1560-1568, 2015. (SCI, IF=1.269, Rank= 30/56 )
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M.Z. Yang, C.L. Dai*, C.C. Wu, “Sol-gel zinc oxide humidity sensors integrated with a ring oscillator circuit on-a-chip, Sensors, Vol. 14, pp. 20360-20371, 2014. (SCI, IF= 2.245, Rank=10/56)
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C.C. Hsu, C.Y. Yang, C.J. Lai, C.L. Dai, “Optimization of the reusable poly-silicon nanowire sensor of salt concentration measurement,” Japanese Journal of Applied Physics, Vol. 53, p. 06JE04, 2014. (SCI, IF=1.127, Rank=97/144)
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J.Z. Tseng, C.C. Wu, C.L. Dai*, “Modeling and manufacturing of a micromachined magnetic sensor using the CMOS process without any post-process,” Sensors, Vol. 14, pp. 6722-6733, 2014. (SCI, IF= 2.245, Rank=10/56)
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M.Z. Yang, C.L. Dai*, P.J. Shih, “An acetone microsensor with a ring oscillator circuit fabricated using the commercial 0.18 μm CMOS process,” Sensors, Vol. 14, pp. 12735-12747, 2014. (SCI, IF= 2.245, Rank=10/56)
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Y.C. Hu, C.L. Dai*, C.C. Hsu, “Titanium dioxide nanoparticle humidity microsensors integrated with circuitry on chip,” Sensors, Vol. 14, pp. 4177-4188, 2014. (SCI, IF= 2.245, Rank=10/56)
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C.C. Yeh, C.L. Dai*, H.F. Shih, “Fabrication and characterization of thermoelectric microgenerators with carbon nanotube,” Sensors and Materials, Vol. 26, pp.75-83, 2014. (SCI, IF=0.450, Rank=50/56)
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C.Y. Lin, C.L. Dai*, “Manufacture of radio frequency micromachined switches with annealing”, Sensors, Vol. 14, pp. 1680-1690, 2014. (SCI, IF= 2.245, Rank=10/56)
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M.Z. Yang, C.L. Dai*, W.Y. Lin, “Resistive humidity microsensor with circuit manufactured by the CMOS process,” Microelectronic Engineering, Vol. 105, pp. 81-85, 2013. (SCI, IF=1.338, Rank=110/248)
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H.F. Shih, D.Y. Wu, C.L. Tien, C.L. Dai, “Optical compensator with switchable mode using polymer stabilized liquid crystals”, Optical Review, Vol. 20, pp. 218-223, 2013. (SCI, IF=0.546, Rank=73/83)
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G.M. Lin, C.L. Dai*, M.Z. Yang, “A zirconium dioxide ammonia microsensor integrated with a readout circuit manufactured using the 0.18 mm CMOS Process,” Sensors, Vol. 13, pp. 3664-3674, 2013. (SCI, IF=2.048, Rank=10/57)
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M.Z. Yang, C.C. Wu, C.L. Dai*, W.J. Tsai, “Energy harvesting thermoelectric generators manufactured using the complementary metal oxide semiconductor process,” Sensors, Vol. 13, pp. 2359-2367, 2013. (SCI, IF=2.048, Rank=10/
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W.Z. Liao, C.L. Dai*, M.Z. Yang, “Micro ethanol sensors with a heater fabricated using the commercial 0.18 μm CMOS process,” Sensors, Vol. 13, pp.12760-12770, 2013. (SCI, IF=2.048, Rank=10/57)
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C.H. Hsieh, C.L. Dai*, M.Z. Yang, “Fabrication and characterization of CMOS-MEMS magnetic microsensors,” Sensors, Vol. 13, pp.14728-14739, 2013. (SCI, IF=2.048, Rank=10/57)
25
T.Y. Chiang, C.L. Dai*, “Enhancement of intrinsic emission from ultrathin ZnO films by using Si-nanopillars template,” Nanoscale Research Letters, Vol. 7, pp. 263, 2012. (SCI, IF=2.524, Rank=25/127)
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M.Z. Yang, C.L. Dai*, C.B. Hung, “Fabrication of a glucose sensor with oscillator circuit using CMOS-MEMS technique,” Microelectronic Engineering, Vol. 97, pp. 353-356, 2012. (SCI, IF=1.224, Rank=109/242)
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Y.M. Ching, C.L. Dai*, “Influence of annealing temperature on the mechanical properties of SiGe epitaxial thin film,” Journal of Engineering, National Chung Hsing University, Vol. 23, pp. 51-57, 2012.
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M.Z. Yang, C.L. Dai*, C.C. Wu, “A zinc oxide nanorod ammonia microsensor integrated with a readout circuit on-a-chip,” Sensors, Vol. 11, pp. 11112-11121, 2011. (SCI, IF=1.739, Rank=14/58)
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M.Z. Yang, C.L. Dai*, J.Y. Hong, “Manufacture and characterization of high Q-factor inductors based on CMOS-MEMS techniques,” Sensors, Vol. 11, pp. 9798-9806, 2011. (SCI, IF=1.739, Rank=14/58)
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M.Z. Yang, C.L. Dai*, P.J. Shih, Y.C. Chen, “Cobalt oxide nanosheet humidity sensor integrated with circuit on chip”, Microelectronic Engineering, Vol. 88, pp. 1742-1744, 2011. (SCI, IF=1.557, Rank=72/244)
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T.Y. Chiang, C.L. Dai*, D.M. Lian, “Influence of growth temperature on the optical and structural properties of ultrathin ZnO films,” Journal of Alloys and Compounds, Vol. 509, pp. 5613-5626, 2011. (SCI, IF=2.289, Rank=4/75)
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M.Z. Yang, C.L. Dai*, W.Y. Lin, “Fabrication and characterization of polyaniline/PVA humidity microsensors,” Sensors, Vol. 11, pp. 8143-8151, 2011. (SCI, IF=1.739, Rank=14/58)
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M.Z. Yang, C.L. Dai*, P.J. Shih, Z.Y. Tsai, “Capacitive RF switches manufactured by the CMOS-MEMS technique”, Microelectronic Engineering, Vol. 88, pp. 2242-2246, 2011. (SCI, IF=1.557, Rank=72/244)
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Y.M. Chang, C.L. Dai*, T.C. Cheng, C.W. Hsu, “Nanocone SiGe antireflective thin films fabricated by ultrahigh vacuum chemical vapor deposition with in-situ annealing,” Thin Solid Films, Vol. 518, pp. 3782-3785, 2010. (SCI, IF=1.909, Rank=3/18)
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M.Z. Yang, C.L. Dai*, D.H. Lu, “Polypyrrole porous micro humidity sensor integrated with a ring oscillator circuit on chip,” Sensors, Vol. 10, pp. 10095-10104, 2010. (SCI, IF=1.774, Rank=14/61)
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C.Y. Lee, C. Chang, W.P. Shih, C.L. Dai, “Wet etching rates of InGaZnO for the fabrication of transparent thin-film transistors on plastic substrates,” Thin Solid Films, Vol. 518, pp. 3992-3998, 2010. (SCI, IF=1.909, Rank=3/18)
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C.L. Dai*, Y.C. Chen, C.C. Wu, C.F. Kuo, “Cobalt oxide nanosheet and CNT micro carbon monoxide sensor integrated with readout circuit on chip,” Sensors, Vol. 10, pp. 1753-1764, 2010. (SCI, IF=1.774, Rank=14/61)
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P.H. Kao, P.J. Shih, C.L. Dai*, M.C. Liu, “Fabrication and characterization of CMOS-MEMS thermoelectric micro generators,” Sensors, Vol. 10, pp. 1315-1325, 2010. (SCI, IF=1.774, Rank=14/61)
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M.C. Liu, C.L. Dai*, C.H. Chan, C.C. Wu, “Manufacture of a polyaniline nanofiber ammonia sensor integrated with a readout circuit using the CMOS-MEMS technique,” Sensors, Vol. 9, pp. 869-880, 2009. (SCI, IF=1.821, Rank=11/58)
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C.L. Dai*, P.W. Lu, C. Chang, C.Y. Liu, “Capacitive micro pressure sensor integrated with a ring oscillator circuit on chip,” Sensors, Vol. 9, pp. 10158-10170, 2009. (SCI, IF=1.821, Rank=11/58)
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C.L. Dai*, P.W. Lu, C.C. Wu, C. Chang, “Fabrication of wireless micro pressure sensor using the CMOS process,” Sensors, Vol. 9, pp. 8748-8760, 2009. (SCI, IF=1.821, Rank=11/58)
42
P.H. Kao, C.L. Dai*, C.C. Hsu, C.Y. Lee, “Manufacture of micromirror array using CMOS-MEMS technique,” Sensors, Vol. 9, pp. 6219-6231, 2009. (SCI, IF=1.821, Rank=11/58)
43
P.H. Kao, C.L. Dai*, C.C. Hsu, C.Y. Lee, “Fabrication and characterization of a tunable In-plane resonator with low driving voltage,” Sensors, Vol. 9, pp. 2062-2075, 2009. (SCI, IF=1.821, Rank=11/58)
44
C.L. Dai*, P.H. Kao, Y.W. Tai, C.C. Wu, “Micro FET pressure sensor manufactured using CMOS-MEMS technique,” Microelectronics Journal, Vol. 39, pp. 744-749, 2008. (SCI, IF=0.857, Rank=132/229)
45
C.Y. Lee, S.J. Lee, C.L. Dai, and C.W. Chuang, “Application of porous silicon on the gas diffusion layer of micro fuel cells,” Key Engineering Materials, Vol. 364-366, pp. 849-854, 2008. (EI)
46
Y.M. Chang, C.L. Dai*, T.C. Cheng, C.W. Hsu, “Effect of annealing temperature for Si0.8Ge0.2 epitaxial thin films,” Applied Surface Science, Vol. 254, pp. 3105-3109, 2008. (SCI, IF=1.576, Rank=4/16)
47
C.C. Wu*, C.C. Hsu, J.Y. Lee, H.Y. Chen, C.L. Dai, “Optical heterodyne laser encoder with sub-nanometer resolution’, Measurement Science and Technology, Vol. 19, 045305, 2008. (SCI, IF=1.493, Rank=12/68)
48
C.Y. Lee, S.J. Lee, C.L. Dai, C.H. Wu, and M.D. Ger, “Integration of micro temperature sensor and heater in a stainless steel-based micro reformer,” Key Engineering Materials, Vol. 364-366, pp. 843-848, 2008. (EI)
49
C.Y. Lee, S.J. Lee, C.L. Dai, C.L. Hsieh, Y.M. Lee, “Metal bipolar plate with micro sensors,” Key Engineering Materials, Vol. 364-366, pp. 861-866, 2008. (EI)
50
C.Y. Lee, S.J. Lee, C.L. Dai, C.H. Wu, G.W. Wu, “Monitoring of temperature distribution within a silicon-based micro reformer using array micro sensors,” Key Engineering Materials, Vol. 364-366, pp. 816-821, 2008. (EI)
51
C.L. Dai*, H.M. Hsu, M.C. Tsai, M.M. Hsieh, M.W. Chang, “Modeling and fabrication of a microelectromechanical microwave switch,” Microelectronics Journal, Vol. 38, pp. 519-524, 2007. (SCI, IF=0.609, Rank=132/227)
52
C.L. Dai*, M.C. Chiang, M.W. Chang, “Simulation and fabrication of HF microelectromechanical bandpass,” Microelectronics Journal, Vol. 38, pp. 828-833, 2007. (SCI, IF=0.609, Rank=132/227)
53
H.Y Lin*, J.H. Lee, M.K. Wei, C.L. Dai, et al, “Improvement of the outcoupling efficiency of an organic light-emitting device by attaching microstructured films,” Optics Communications, Vol. 275, pp. 464-469, 2007. (SCI, IF=1.314, Rank=21/64)
54
C.L. Dai*, Y.M. Chang, “A resonant method for determining mechanical properties of Si3N4 and SiO2 thin films,” Materials Letters, Vol. 61, pp. 3089-3092, 2007. (SCI, IF=1.625, Rank=52/190)
55
C.L. Dai*, M.C. Liu, “Complementary-metal-oxide semiconductor microelectromechanical pressure sensor integrated with circuits on chip,” Japanese Journal of Applied Physics, Vol. 46, No. 2, pp. 843-848, 2007. (SCI, IF=1.247, Rank=50/94)
56
C.L. Dai*, M.C. Liu, F.S. Chen, C.C. Wu, M.W. Chang, “A nanowire WO3 humidity sensor integrated with micro heater and inverting amplifier circuit on chip manufactured using CMOS-MEMS technique,” Sensors and Actuators B, Vol. 123, pp. 896-901, 2007. (SCI, IF=2.934, Rank=3/55)
57
C.L. Dai*, C.H. Kuo, M.C. Chiang, “Microelectromechanical resonator manufactured using CMOS-MEMS technique,” Microelectronics Journal, Vol. 38, pp. 672-677, 2007. (SCI, IF=0.609, Rank=132/227)
58
C.L. Dai*, Y.W. Tai, P.H. Kao, “Modeling and fabrication of micro FET pressure sensor with Circuits,” Sensors, Vol. 7, pp. 3386-3398, 2007. (SCI, IF=1.573, Rank=13/55)
59
C.L. Dai*, “A capacitive humidity sensor integrated with micro heater and ring oscillator circuit fabricated by CMOS-MEMS technique,” Sensors and Actuators B, Vol. 122, pp. 375-380, 2007. (SCI, IF=2.934, Rank=3/55)
60
C.L. Dai*, Y.L. Chen, “Modeling and manufacturing of micromechanical RF switch with inductors,” Sensors, Vol. 7, pp. 2660-2670, 2007. (SCI, IF=1.573, Rank=13/55)
61
C.L. Dai*, S.C. Lin, M.W. Chang, “Fabrication and characterization of a microelectromechanical tunable capacitor,” Microelectronics Journal, Vol. 38, pp. 1257-1262, 2007. (SCI, IF=0.609, Rank=132/227)
62
L.J. Yang*, J.M. Wang, K.C. Ko, W.P. Shih, C.L. Dai, “A circular microchannel integrated with embedded spiral electrodes used for fluid transportation,” Sensors and Actuators A, Vol. 139, pp. 172-177, 2007. (SCI, IF=1.348, Rank=17/55)
63
C.L. Dai*, H.M. Hsu, M.C. Liu, M.K. Wei, M.W. Chang, “Fabrication of a micromachined tunable capacitor using the complementary metal oxide semiconductor post-process of etching metal layers,” Japanese Journal of Applied Physics, Vol. 45, No. 2A, pp. 1018-1020, 2006. (SCI, IF=1.222, Rank=39/84)
64
C.L. Dai*, J.H. Chen, “Low voltage actuated RF micromechanical switches fabricated using CMOS-MEMS technique,” Microsystem Technologies, Vol. 12, pp. 1143-1151, 2006. (SCI, IF=0.673, Rank=107/206)
65
C.Y. Lee, P.Z. Chang, Y.Y. Chen, C. L. Dai, X.Y. Wang, P.H. Chen, S.J. Lee, “A novel method for in-situ monitoring of the thickness of a silicon wafer during wet etching,” Sensors and Materials, Vol. 18, No. 2, pp. 71-82, 2006. (SCI, IF=0.585, Rank=34/53)
66
C.L. Dai*, “A maskless wet etching silicon dioxide post-CMOS process and its application,” Microelectronic Engineering, Vol. 83, pp. 2543-2550, 2006. (SCI, IF=1.398, Rank=48/206)
67
C.L. Dai*, W.C. Yu, “A micromachined tunable resonator fabricated by the CMOS post-process of etching silicon dioxide,” Microsystem Technologies, Vol. 12, pp. 766-772, 2006. (SCI, IF=0.673, Rank=107/206)
68
Y.C. Cheng, C.L. Dai*, C.Y. Lee, P.H. Chen, P.Z. Chang, “A circular micromirror array fabricated by a maskless post-CMOS process,” Microsystem Technologies, Vol. 11, pp. 444-451, 2005. (SCI, IF=0.720, Rank=100/208)
69
C.Y. Lee*, P.Z. Chang, Y.Y. Chen, C.L. Dai, P.H. Chen, S. J. Lee, “ Novel method for in situ monitoring of thickness of quartz during wet etching,” Japanese Journal of Applied Physics, Vol. 44, No. 10, 7662-7666, 2005. (SCI, IF=1.096, Rank=41/83)
70
C.L. Dai*, J. H. Chiou, M.S.C. Lu, “A maskless post-CMOS bulk micromachining process and its application,” Journal of Micromechanics and Microengineering, vol. 15, pp. 2366-2371, 2005. (SCI, IF=2.499, Rank=2/52)
71
C.L. Dai*, H.J. Peng, M.C. Liu, C.C. Wu, H.M. Hsu, L.J. Yang, “A micromachined microwave switch fabricated by the complementary metal-oxide semiconductor post-process of etching silicon dioxide,” Japanese Journal of Applied Physics, Vol. 44, No. 9A, 6804-6809, 2005. (SCI, IF=1.096, Rank=41/83)
72
C.L. Dai*, C.H. Tsai, “Fabrication of integrated chip with microinductors and micro-tunable capacitors by complementary metal-oxide-semiconductor postprocess,” Japanese Journal of Applied Physics, Vol. 44, No. 4A, pp. 2030-2036, 2005. (SCI, IF=1.096, Rank=41/83)
73
L.J. Yang, C.C. Lai, C.L. Dai, P.Z. Chang, “A piezoresistive micro pressure sensor fabricated by commercial DPDM CMOS process,” Tamkang Journal of Science and Engineering, Vol. 8, pp. 67-73, 2005. (EI)
74
C.L. Dai*, H.J. Peng, M.C. Liu, C.C. Wu, L.J. Yang, “ Design and fabrication of RF MEMS switch by the CMOS process,” Tamkang Journal of Science and Engineering, Vol. 8, No. 3, pp 197-202, 2005. (EI)
75
Y.C. Cheng, C.L. Dai, C.Y. Lee, P.H. Chen, P.Z. Chang, “A MEMS micromirror fabricated using CMOS post-process,” Sensors and Actuators A, Vol. 120, pp.573-581, 2005. (SCI, IF=1.363, Rank=10/52)
76
C.L. Dai*, F.Y. Xiao, Y.Z. Juang, C.F. Chiu, “An approach to fabricating microstructures that incorporate circuits using a post-CMOS process,” Journal of Micromechanics and Microengineering, Vol. 15, pp. 98-103, 2005. (SCI, IF=2.499, Rank=2/52)
77
C.L. Dai*, F.Y. Xiao, C.Y. Lee, Y.C. Cheng, P.Z. Chang, S.H. Chang, “Thermal effects in PZT: diffusion of titanium and recrystallization of platinum,” Material Science and Engineering A, Vol. 384, pp. 57-63, 2004. (SCI)
78
Y.C. Cheng, C.Y. Lee, C.L. Dai*, W.J. Chen, P.Z. Chang, P.H. Chen, “Fabrication of free-space MOEM component by CMOS process,” Tamkang Journal of Science and Engineering, Vol. 7, pp. 73-76, 2004. (EI)
79
C.Y. Lee, Y.C. Cheng, Y.Y. Chen, C.L. Dai* et al., “A novel method for measuring the thickness of quartz using a plate wave sensor,” Journal of the Chinese Society of Mechanical Engineers, vol. 25. No. 4, pp. 321-328, 2004. (EI)
80
C.L. Dai*, “In situ electrostatic microactuators for measuring the Young’s modulus of CMOS thin films,” Journal of Micromechanics and Microengineering, Vol. 13, No. 5, pp. 563-567, 2003. (SCI)
81
C.L. Dai*, S.C. Chang, C.Y. Lee, Y.C. Cheng, C.L. Chang, J.H. Chiou, and P.Z. Chang, “Capacitive micro pressure sensors with underneath readout circuit using a standard CMOS process, Journal of the Chinese Institute of Engineers, Vol. 26, No, 2, 237-241, 2003. (SCI)
82
C.L. Dai*, C. Chang, H.L. Chen, P.Z. Chang, “Fabrication of the planar angular rotator using the CMOS process,” Journal of Micromechanics and Microengineering. Vol. 12, No. 3, pp. 247-251, 2002. (SCI)
83
C.L. Dai*, H.L. Chen, C.Y. Lee, P.Z. Chang, “Fabrication of diffractive optical elements using the CMOS process,” Journal of Micromechanics and Microengineering, Vol. 12, No.1, pp. 21-25, 2002. (SCI)
84
C.L. Dai*, K. Yen, P.Z. Chang, “Applied electrostatic parallelogram actuators for microwave switches by standard CMOS process,” Journal of Micromechanics and Microengineering, Vol. 11, No.6, pp. 697-702, 2001. (SCI)
85
C.L. Dai*, H.L. Chen, P.Z. Chang, “Design and fabrication of CMOS optical modulator,” Sensors and Actuators A, Vol. 95, pp.69-74, 2001. (SCI)
86
C.L. Dai*, H.L. Chen, P.Z. Chang, “Fabrication of a micromachined optical modulator using the CMOS process,” Journal of Micromechanics and Microengineering, Vol. 11. No. 5, pp. 612-615, 2001. (SCI)
87
C. Chang, C.L. Dai*, J.Y. Chen, H. Chen, K. Yen, J. Chiou, P.Z. Chang, “A wideband electrostatic microwave switch fabricated by surface micromachining,” Journal of the Chinese Institute of Engineers, Vol. 23, No, 6, 781-787, 2000. (SCI)
88
P.Z. Chang and C.L. Dai*, “Microstructure for measuring residual strains of CMOS thin films”, International Journal of the Japan Society for Precision Engineering, Vol. 33, No. 2, pp. 135-140, 1999. (SCI)
89
C.L. Dai* and P.Z. Chang, “A CMOS surface micromachined pressure sensor”, Journal of the Chinese Institute of Engineers, Vol. 22, pp. 375-380, 1999. (SCI)
90
C.L. Dai*, P.Z. Chang and S.S. Lu, “Design and processing of integrated micro accelerometers using standard CMOS process,” Journal of the Chinese Institute of Engineers, Vol. 20, No. 1, pp.47-55, 1997. (SCI)
91
C.L. Dai*, P.Z. Chang and J.J. Wang, “Design and fabrication of microsensors using standard CMOS IC process,” Journal of the Chinese Society of Mechanical Engineers, Vol. 18, No 3, pp.283-291, 1997. (EI)
92
C.L. Dai* and P.Z. Chang, “In-situ micro strain gauges for measuring residual strain of three CMOS thin films using only on maskless post-processing step,” Journal of the Chinese Institute of Engineers, Vol. 20, No. 5, pp.539-548, 1997. (SCI)
1
P.J. Shih, C.L. Dai, K.W. Chou, “A method to measure natural frequency of a spherical specimen in liquid environment by appliy atomic force microscope,” 2016 International congress on Engineering and Information, Osaka, Japan, May 10-12, 2016.
2
W.C. Shen, C.L. Dai, Y.C. Tsai, “Low concentration ammonia gas microsensor,” Symposium on Nano Device Technology, Hsinchu, Taiwan, May 12-13, 2016.
3
C.H. Fang, C.L. Dai, Y.C. Tsai, “Ultraviolet-selective photodiode,” Symposium on Nano Device Technology, Hsinchu, Taiwan, May 12-13, 2016.
4
B.H. Chen, C.L. Dai, Y.C. Tsai, “A piezoelectric energy harvester using human motion,” Symposium on Nano Device Technology, Hsinchu, Taiwan, May 12-13, 2016.
5
W. Chen, C.L. Dai, Y.C. Tsai, “Three dimensional magnetic micro field sensor with low power dissipation,” Symposium on Nano Device Technology, Hsinchu, Taiwan, May 12-13, 2016.
6
C.C.Hsu., C.T. Meng., C.C. Cheng, C.C. Wu, C.L. Dai, “Fabrication of high transmittance SiO2 nanotexture with optimal spin-coating method,” 27th International Microprocesses and Nanotechnology Conference, Toyama, Japan, November 10-13, 2015.
7
林彥男, 戴慶良, “磁電晶體式三維磁場感測器,” 第十九屆奈米工程暨微系統技術研討會,台北, August 13-14, 2015.
8
方智弘, 戴慶良, “紫外光微感測器,” 第三十二屆全國學術研討會, 高雄, December 11-12, 2015.
9
陳柏豪, 戴慶良, “手腕穿戴式壓電集能器,” 第三十二屆全國學術研討會, 高雄, December 11-12, 2015.
10
沈暐鈞, 戴慶良, “檢測低濃度氨氣之微型氣體感測器,” 第三十九屆全國力學會議, 台北, November 20-21, 2015.
11
陳煒仁, 戴慶良, “結合MAGFET之磁電晶體三維磁場感測器,” 第三十九屆全國力學會議, 台, November 20-21, 2015.
12
M.Z. Yang, C.L. Dai, “A capacitive ammonia sensor using the commercial 0.18 μm CMOS process”, 2014 International Conference on Future Materials Engineering and Industry Application, Hong Kong, December 10-11, 2014.
13
P.J. Shih, P.I.T. Chang, W.P. Shih, C.L. Dai, “Frequency function of noncontact AFM liquid environment”, 2014 International Conference on Non-contact Atomic Force Microscopy, Tsukuba, Japan, August 4-8, 2014.
14
Y.R. Guo, W.P. Shih, C.L. Dai, P.J. Shih, “A mathematical model for the oscillation of the eyeball”, 2014 International Research Conference on Engineering and Technology, Bali, Indonesia, June 28-29, 2014.
15
C.C. Hsu, Y.C. Liao, P.L. Li, C.L. Dai, C.C. Wu, “Salt concentration measurement with single/multiple silicon nanowire sensor,” 2014 Micro and Nano Engineering, Lausanne, Switzerland, September 22-26, 2014.
16
C.C. Wu, J.Y. Lee, C.C. Hsu, C.L. Dai, J.Y. Jeng, “A simple evaluation of grating scale for linear optical encoder”, 2014 Micro and Nano Engineering, Lausanne, Switzerland, September 22-26, 2014.
17
J.Z. Tseng, C.L. Dai, “Design and fabrication of 3D magnetic microsensor,” 2014 Symposium on Nano Device Technology, Hsinchu, Taiwan, May 1-2, 2014.
18
W.L. Lee, C.L. Dai, “Design and fabrication of thermoelectric generator using electroplating process,” 2014 Symposium on Nano Device Technology, Hsinchu, Taiwan, May 1-2, 2014.
19
M.Z. Yang, C.L. Dai, “Fabrication of a gas sensor array integrated with ring oscillator circuit on chip using CMOS-MEMS process,” 2014 Symposium on Nano Device Technology, Hsinchu, Taiwan, May 1-2, 2014.
20
C.F. Fong, C.L. Dai, “Micro gas sensor array for detection of VOCs,” 2014 Symposium on Nano Device Technology, Hsinchu, Taiwan, May 1-2, 2014.
21
M.Z. Yang, C.Li. Dai, “Fabrication of an integrated acetone microsensor using CMOS-MEMS process”, 18th Nano Engineering and Microsystem Technology Conference, Tainan, B03-112, August 21-22, 2014.
22
J.Z. Tseng, Y.N. Lin, C.L. Dai, “3D magnetic microsensor based on NPN magneto-transistor”, 18th Nano Engineering and Microsystem Technology Conference, Tainan, PC-11, August 21-22, 2014.
23
M.Z. Yang, C.L. Dai, “An Ammonia Sensor manufactured Using the Commercial 0.18 μm CMOS Process”, 2014 CSME, Taichung, No.03240, December 6-7, 2014.
24
林嘉哲, 戴慶良, “可撓式廢熱回收發電系統”,第三十八屆全國力學會議, 基隆, No.659, November 21-22, 2014.
25
林彥男, 戴慶良, “整合磁電晶體式磁場感測器與紫外光感測器”,第三十八屆全國力學會議, 基隆, No.572, November 21-22, 2014.
26
鄭文豪, 戴慶良, “應用於血糖異常偵測之微型氣體感測器之設計與模擬”,第三十八屆全國力學會議, 基隆, No.671, November 21-22, 2014.
27
林嘉哲, 戴慶良, “可撓式熱電發電器設計及其應用”,中國機械工程學會第三十一屆全國學術研討會, 台中, No.03097, December 6-7, 2014.
28
林彥男, 戴慶良, “整合3-D磁場感測器與紫外光感測器”,中國機械工程學會第三十一屆全國學術研討會, 台中, No.03113, December 6-7, 2014.
29
鄭文豪, 戴慶良, “檢測低濃度丙酮之微型氣體感測器之設計與模擬”,中國機械工程學會第三十一屆全國學術研討會, 台中, No.03147, December 6-7, 2014.
30
戴慶良, 李汪麟, 曾健治, 楊閔智, “可撓性基材的熱電式發電器之研製”, 自動化技術研討會, 雲林虎尾, November 14-15, 2014.
31
戴慶良, 馮建富, 楊閔智, 運用CMOS-MEMS技術研製揮發性氣體感測器陣列”, 自動化技術研討會, 雲林虎尾, November 14-15, 2014.
32
李汪麟, 林嘉哲, 戴慶良, “利用電鍍技術製作可撓式熱電發電器”, 第十八屆奈米工程暨技術研討會, 台南, B02-84, August 21-22, 2014.
33
馮建富, 鄭文豪, 戴慶良, “檢測揮發性有機化合物之微型氣體感測陣列”,第十八屆奈米工程暨技術研討會, 台南, BD-117, August 21-22, 2014.
34
王繼弘, 戴慶良, “應用玻璃表面蝕刻技術於抗眩光玻璃之研究”, 第六屆綠色科技工程與應用研討會, 台中, May 21, 2014.
35
方新傑, 戴慶良, “溫度對積體電路測試良率之研究”, 第六屆綠色科技工程與應用研討會, 台中, May 21, 2014.
36
M. Z. Yang, C.L. Dai, “Fabrication of a humidity microsensor with circuit based on zinc oxide nanowire,” Int. Conf. Electrical Control Automation Engineering, Hongkong, China, pp. 372-378, December 1-2, 2013. (EI)
37
S.W. Peng, M.Z. Yang, C.L. Dai, “Manufacture of thermoelectric micr generator using the commercial CMOS process,” Int. Conf. Electrical Control Automation Engineering, Hongkong, China, pp. 302-306, December 1-2, 2013. (EI)
38
C.L. Dai, M.Z. Yang, S.W. Peng, “An energy harvesting device manufactured using the commercial 0.18 mm CMOS process,” IEEE Int. Conf. Nano/Micro Engineered and Molecular Systems, Suzhou, China, pp. 128-131, 2013. (EI)
39
M.Z. Yang, C.L. Dai, “Fabrication of an ammonia microsensor based on zinc oxide,” IEEE Int. Conf. Nano/Micro Engineered and Molecular Systems, Suzhou, China, pp. 270-273, 2013. (EI)
40
W.C. Liao, C.L. Dai, “Integrated micro gas sensing array,” 2013 Symposium on Nano Device Technology, Hsinchu, Taiwan, May 2013.
41
C.C. Yeh, C.L. Dai, “Waste heat recovery using micro thermoelectronic generator,” 2013 Symposium on Nano Device Technology, Hsinchu, Taiwan, May 2013.
42
C.H. Hsieh, C.L. Dai, “Design and simulation of magnetic sensor,” 2013 Symposium on Nano Device Technology, Hsinchu, Taiwan, May 2013.
43
C.H. Hsieh, J.Z. Zeng, C.L. Dai, “Design and fabrication of Lorentz force magnetic sensors,” The 17 th Nanotechnology and Microsystem Technology Conference, Taichung, Taiwan, August 22-23, 2013.
44
W.C. Liao, W.L. Lee, C.L. Dai, “Design and manufacture of micro gas sensing array using the CMOS-MEMS process,” The 17 th Nanotechnology and Microsystem Technology Conference, Taichung, Taiwan, August 22-23, 2013.
45
C.C. Yeh, W.L. Lee, C.L. Dai, “Fabrication and characterization of thermoelectric micro generators with carbon nanotube,” The 17 th Nanotechnology and Microsystem Technology Conference, Taichung, Taiwan, August 22-23, 2013.
46
馮建富, 戴慶良, “檢測揮發性有機化合物之微型氣體感測器陣列,” 第三十屆中國機械工程會議,” 宜蘭, December 6-7, 2013.
47
李汪麟, 戴慶良, “利用電鍍法設計和製作熱電發電器,” 第三十屆中國機械工程會議,” 宜蘭, December 6-7, 2013.
48
曾健治, 戴慶良, “磁電晶體式之微磁場感測器,” 第三十屆中國機械工程會議,” 宜蘭, December 6-7, 2013.
49
C.Y. Lin, C.L. Dai, “Integrated of spiral inductor to the microwave switch,” 2012 Symposium on Nano Device Technology, Hsinchu, 2012.
50
S.W. Peng, C.L. Dai, M.Z. Yang, “CMOS-MEMS micro thermoelectronic generator,” 2012 Symposium on Nano Device Technology, Hsinchu, 2012.
51
謝瑱軒, 戴慶良, “應用勞倫茲力的磁場感測器,” 第二十九屆中國機械工程會議, 高雄, 2012.
52
葉峻嘉, 戴慶良, “陣列式微型熱電發電器, 第二十九屆中國機械工程會議,” 高雄, 2012.
53
廖維溱, 戴慶良, “整合型微氣體感測器陣列, 第二十九屆中國機械工程會議,” 高雄, 2012.
54
戴慶良, 楊閔智, 胡育智, 林冠明, “整合積體感測電路的微氣體感測器,” 第二十屆全國自動化科技研討會, 桃園, 2012。
55
戴慶良, 楊閔智, 彭世瑋, 林承陽, “CMOS-MEMS熱電式微發電器,” 第二十屆全國自動化科技研討會, 桃園, 2012。
56
劉佳欣, 戴慶良, “薄型TFT-LCD面板切割製程之研究,” 第二十屆全國自動化科技研討會, 桃園, 2012.
57
謝瑱軒, 戴慶良, “應用勞倫茲力的磁場感測器,” 第二十屆全國自動化科技研討會, 桃園, 2012.
58
葉峻嘉, 戴慶良, “陣列式微型熱電發電器,” 第二十屆全國自動化科技研討會, 桃園, 2012.
59
廖維溱, 戴慶良, “整合型微氣體感測器陣列,”第二十屆全國自動化科技研討會, 桃園, 2012.
60
M.Z. Yang, C.L. Dai, W.J. Tsai, “Thermoelectric micro generators manufactured using CMOS-MEMS technique,” 2011 Int. Conference on Micro and Nano Engineering, Berlin, Germany, 2011. (EI)
61
M.Z. Yang, C.L. Dai, C.B. Hung, “Fabrication of a glucose sensor with oscillator circuit using CMOS-MEMS technique,” 2011 Int. Conference on Micro and Nano Engineering, Berlin, Germany, 2011. (EI)
62
M.Z. Yang, C.L. Dai, W.Y. Lin, Resistive humidity microsensor with circuit manufactured by the CMOS process, 2011 Int. Conference on Micro and Nano Engineering, Berlin, Germany, 2011. (EI)
63
M.Z. Yang, C.L. Dai, D.H. Lu, “Fabrication of Capacitive Humidity Microsensor Based on CMOS-MEMS Technique,” 2011 Automation, Taiwan, 2011.
64
W.Y. Lin, C.L. Dai, “Composite Film Micro Humidity Sensor Integrated with Circuit,” 2011 Symposium on Nano Device Technology, Hsinchu, 2011.
65
W.J. Tsai, C. L. Dai, “Micro Thermoelectric Energy Harvester Based on CMOS-MEMS Technique,” Symposium on Nano Device Technology, Hsinchu, 2011.
66
C.L. Dai, “Micro gas sensors fabricated using CMOS-MEMS technique,” Symposium on Nano Device Technology, Invitated speaker, Hsinchu, 2011.
67
G.M. Lin, C.L. Dai, “Ammonia gas sensors integrated with readout circuit,” 2011CSME, Taichung, 2011.
68
S.W. Peng, C.L. Dai,“CMOS-MEMS micro-thermoelectric generator,” 2011CSME, Taichung, 2011.
69
Y.C. Hu, C.L. Dai,“Micro Carbon Monoxide Gas Sensor Integrated with Circuit,” 2011CSME, Taichung, 2011.
70
C.Y. Lin, C.L. Dai, “Integrated of spiral inductor to the microwave switch,” 2011CSME, Taichung, 2011.
71
林冠明,戴慶良, “整合型氨氣微氣體感測器,”第十五屆奈米工程暨微系統技術研討會,台北, 2011.
72
彭世瑋,戴慶良,“低損耗微型熱電式發電器,”第十五屆奈米工程暨微系統技術研討會,台北, 2011.
73
胡育智,戴慶良,“一氧化碳微氣體感測器,”第十五屆奈米工程暨微系統技術研討會, 台北, 2011.
74
林承陽,戴慶良,“低驅動電壓及高隔離度之微波開關設計,”第十五屆奈米工程暨微系統技術研討會,台北, 2011.
75
C.L. Dai, D.H. Lu, “Fabrication of a micro humidity sensor with polypyrrole using the CMOS process,” IEEE Int. Conf. Nano/Micro Engineered and Molecular Systems, Xiamen, China, pp. 115-118, 2010. (EI)
76
C.L. Dai, Y.C. Chen, M.Z. Yang, P.J. Shih, “Cobalt oxide nanosheet humidity sensor integrated with circuits on chip,” 2010 International Conference on Micro and Nano Engineering, Genoa, Italy, 2010. (EI)
77
C.L. Dai, PJ Shih, ZY Tsai, MZ Yang, “Capacitive RF switches manufactured by the CMOS-MEMS technique,” 2010 International Conference on Micro and Nano Engineering, Genoa, Italy, 2010. (EI)
78
M.Z. Yang, C.L. Dai, Z.Y. Tsai, C.B. Hung, “Carbon monoxide micro sensors integrated with readout circuit,” Automation 2010, Chungli, Taiwan, A06-0006, 2010.
79
C.B. Hung, C.L. Dai, Z.Y. Tsai, M.Z. Yang, “Integrated lipopolysaccharide biosensors with readout circuitry,” Automation 2010, Chungli, Taiwan, 2010.
80
Z.Y. Tsai, C.L. Dai, C.B. Hung, M.Z. Yang, “Fabrication and characterization of RF CMOS-MEMS switches,” Automation 2010, Chungli, Taiwan, 2010.
81
M.Z. Yang, P.H. Kao, C.L. Dai, “Design of CMOS-MEMS micro CO sensors,” Symposium on Nano Device Technology, pp. 72-75, Hsinchu, Taiwan, 2010.
82
Z.Y. Tsai, P.H. Kao, C.L. Dai, “RF MEMS switch with low insertion loss and high isolation,” Symposium on Nano Device Technology, pp. 76-79, Hsinchu, Taiwan, 2010.
83
C.B. Hung, P.H. Kao, Ching-Liang Dai, “Lipopolysaccharide biosensors,” Symposium on Nano Device Technology, pp. 68-71, Hsinchu, Taiwan, 2010.
84
楊閔智, 戴慶良, “水熱合成法製備氧化鋅之整合型氨氣微感測器,” 第十四屆奈米工程暨微系統技術研討會, 高雄, pp. 119-122, 2010.
85
林威邑, 戴慶良, “聚苯胺摻雜多壁奈米碳管整合電路之葡萄糖感測器,” 第十四屆奈米工程暨微系統技術研討會, 高雄, pp. 66-69, 2010.
86
蔡文榮, 戴慶良, “CMOS-MEMS高效率微熱電發電機之設計與製作,” 第十四屆奈米工程暨微系統技術研討會, 高雄, pp. 187-190, 2010.
87
林威邑, 戴慶良, “整合式二氧化碳微氣體感測器,”第三十四屆全國力學會議, 雲林, G2014, 2010.
88
陳沂宏, 林威邑, 戴慶良, “矽奈米線酸鹼值反應特性探討,” 第三十四屆全國力學會議, 雲林, H1007, 2010.
89
馬為頎, 戴慶良, “三階微機械式帶通共振器,” 第三十四屆全國力學會議, 雲林, G2013, 2010.
90
林胤宏, 戴慶良, “觸覺微壓力感測器,” 第三十四屆全國力學會議, 雲林, G2015, 2010.
91
蔡文榮, 戴慶良, “以熱電為基礎的微能源收集器,” 第三十四屆全國力學會議, 雲林, I2007, 2010.
92
P.H. Kao, C.L. Dai, C.-C. Hsu, C.N. Mo, C.P. Lee, M.W. Huang, “Micro-Mirror Array Fabricated by the CMOS Process for Applications of MEMS Display,” SID's Display Week 2009, Texas, USA, pp. 1759-1762, 2009.
93
P.H. Kao, C.L. Dai, C.C. Hsu, C.N. Mo, C.P. Lee, M.W. Huang, “Two-Axes Rotatable Micromirror Array for Applications of MEMS Display,” International Display Manufacturing Conference/3DSA/Asia Display, Taipei, Taiwan, Wed-P6-02, 2009.
94
P.H. Kao, C.L. Dai, “Fabrication and characterization of CMOS-MEMS micro thermoelectrical generators,” International Conference on Mechatronic System of Integration and Application, Tainan, Taiwan, Em-07, 2009.
95
Y.M. Chang, C.L. Dai, T.C. Cheng, C.W. Hsu, J.Y. Yao, “Fabrication of nanoislands SiGe antireflective thin films by ultrahigh vacuum chemical vapor deposition with in-situ annealing,” Symposium on Nano Device Technology, pp. 56-60, Hsinchu, Taiwan, 2009.
96
B.W. Lu, C.L. Dai, “Design and fabrication of FET micro-pressure sensor integrated with wireless transmitter,” Symposium on Nano Device Technology, Hsinchu, Taiwan, NB01, 2009
97
C.L. Dai, Y.C. Chen, “Nano-sheets CoOOH micro carbon monoxide sensor integrated with readout circuit,” Symposium on Nano Device Technology, Hsinchu, Taiwan, NB01, 2009.
98
B.S. Liu, P.H. Kao, C.L. Dai, “Simulation and fabrication of a high-order micromechanical band-pass filter,” Symposium on Nano Device Technology, Hsinchu, Taiwan, NB04, 2009.
99
P.H. Kao, C.L. Dai, “A electrostatic driving rotatable micromirror array,” 13th Conference of Nano and Microsystem Technology, Hsinchu, Taiwan, 08-1053, 2009.
100
B.W. Lu, C.L. Dai, “An integrated FET micro pressure sensor fabricated by the post-CMOS process,” 13th Conference of Nano and Microsystem Technology, Hsinchu, Taiwan, 07-1052, 2009.
101
Y.C. Chen, C.L. Dai, “Nano-sheets CoOOH micro CO monoxide sensor integrated with wireless transmitter,” 13th Conference of Nano and Microsystem Technology, Hsinchu, Taiwan, 09-1125, 2009.
102
B.S. Liu, P.H. Kao, C.L. Dai, “Design and manufacture of a high-order micromachined band-pass filter,” 13th Conference of Nano and Microsystem Technology, Hsinchu, Taiwan, 01-1122, 2009.
103
楊閔智, 高斌栩, 戴慶良, “CMOS-MEMS一氧化碳微感測器之設計與分析”, 第33屆全國力學會議，苗栗, H2-367, 2009.
104
蔡宗佑, 高斌栩, 戴慶良, “高隔離度的微機電射頻開關設計與製作”, 第33屆全國力學會議, 苗栗, H2-355, 2009.
105
洪晟倍, 高斌栩, 戴慶良, “脂多醣體生物感測器”, 第33屆全國力學會議, 苗栗, H2-363, 2009.
106
楊閔智, 高斌栩, 戴慶良, “整合輸出電路微一氧化碳氣體感測器之設計與分析”, 第26屆全國機械學術研討會, 台南, E01-012, 2009.
107
蔡宗佑, 高斌栩, 戴慶良, “微機電射頻開關低插入損耗及高隔離度之設計”, 第26屆全國機械學術研討會, 台南, E01-005, 2009.
108
洪晟倍, 高斌栩, 戴慶良, “含感測電路的整合型脂多醣體生物感測器”, 第26屆全國機械學術研討會, 台南, E01-004, 2009.
109
C. L. Dai, J.Y. Hong, M.C. Liu, “High Q-factor CMOS-MEMS inductor’, DTIP of MEMS and MOEMS, Nice, France, April, 2008.
110
M.C. Liu, C.L. Dai and C.H. Chan, “Fabrication and characterization of an ammonia sensor with nanostructure polyaniline,” Asia-Pacific Conference on Transducers and Micro-Nano Technology, Tainan, Taiwan, 2008.
111
Y.M. Chang, C.L. Dai, T.C. Cheng, C.W. Hsu, J.Y. Yao, “The influence of mechanical properties in SiGe epitaxial thin film,” Asia-Pacific Conference on Transducers and Micro-Nano Technology, Tainan, Taiwan, 2008.
112
P. H. Kao, C. L. Dai, “Fabrication and characterization of a tunable in-plane resonator with low driving voltage,” Asia-Pacific Conference on Transducers and Micro-Nano Technology, Tainan, Taiwan, 2008.
113
Y.M. Chang, C.L. Dai, T.C. Cheng, C.W. Hsu, J.Y. Yao, “Influence of strain-relaxed SiGe epilayers with an in-situ thermal annealing”, Symposium on Nano Device Technology, Hsinchu, Taiwan, 2008.
114
戴慶良, 吳昌哲, “脈衝式熱傳對壓焊刀頭斷面溫差之探討,” 第25屆中國機械工程研討會, 員林, Nov., 2008.
115
戴慶良, 李國弘, “應用電腦視覺於CMOS-MEMS微結構後製程檢測,” 第25屆中國機械工程研討會, 員林, Nov., 2008.
116
戴慶良, 高斌栩, “利用書狀結構陣列設計調頻為共振器,” 2008機密機械與製造科技研討會，墾丁, 屏東, 2008.
117
C. L. Dai, M.C. Liu, “A wet etching post-process for CMOS-MEMS RF switches,” IEEE Int. Conf. Nano/Micro Engineered and Molecular Systems, Thailand, pp. 968-971, 2007. (EI)
118
C. L. Dai, M.C. Liu, “Nanoparticle SnO2 gas sensor with circuit and micro heater on chip fabricated using CMOS-MEMS technique,” IEEE Int. Conf. Nano/Micro Engineered and Molecular Systems, Thailand, pp. 959-963, 2007. (EI)
119
Y.M. Chang, C.L. Dai, T.C. Cheng, C.W. Hsu, “Mechanical proprerties of Si0.8Ge0.2 epitaxial thin film,” Int. Conf. Advan. Manufact., Tainan, Taiwan, Nov. 2007.
120
戴慶良, 高斌栩, “CMOS MEMS微機械可調式共振器,”第十屆全國機構與機器設計研討會, pp. 645-650, 台中, Nov. 30, 2007.
121
戴慶良, 林祐鋒, “CMOS射頻傳輸器之設計,” 第24屆中國機械工程研討會, pp. 4992-4996, 中壢, Nov. 23-24, 2007.
122
戴慶良, 高斌栩, “以CMOS-MEMS製程技術設計調頻微共振器,” 第31屆中國力學學研討會, Dec., 2007.
123
戴慶良, 詹熾樺, “利用導電高分子-聚苯胺薄膜製作氨氣感測器,” 第24屆中國機械工程研討會, pp. 4970-4974, 中壢, Nov. 23-24, 2007.
124
戴慶良, 盧德豪, “製作含積體電路之微酒精氣體感測器,” 第24屆中國機械工程研討會, pp. 4965-4969, 中壢, Nov. 23-24, 2007.
125
戴慶良, 林士傑, “應用於射頻之CMOS微可變電容,” 第11屆奈米工程暨微系統技術研討會, August. 30-31 (2007).
126
戴慶良, 陳盈良, “微機械式射頻開關,” 第11屆奈米工程暨微系統技術研討會, August. 30-31 (2007).
127
戴慶良, 洪俊榆, “CMOS MEMS 可調變之帶通濾波器,” 第11屆奈米工程暨微系統技術研討會, August 30-31 (2007).
128
戴慶良, 戴銚葦, “整合積體電路的FET微壓力感測器,” 第11屆奈米工程暨微系統技術研討會, August 30-31 (2007).
129
戴慶良,黃鍾嵐, “含感測電路的FET微濕度感測器,” 第11屆奈米工程暨微系統技術研討會, August 30-31 (2007).
130
戴慶良, 陳盈良, “低插入損耗及高隔離度微機電射頻開關,” 2007現代電機科技研討會, 雲林, pp. 127-131, June 8 (2007).
131
戴慶良, 洪俊榆, “CMOS MEMS可調變之帶通濾波器,” 2007現代電機科技研討會, 雲林, pp. 61-64, June 8 (2007).
132
戴慶良, 黃鍾嵐, “含感測電路的FET微濕度感測器,” 2007現代電機科技研討會, 雲林, pp. 424-428, June 8 (2007).
133
H. M. Hsu, C. L. Dai, M. M. Hsieh, M. C. Tsai, H. J. Peng, “ Implementation and analysis of microwave switch in CMOS-MEMS technology”, IEEE International Circuit and System Conference, May (2006). (EI)
134
H. H. Wang, C. W. Hsu, W. H. Liao, L. J. Yang, C. L. Dai, “ Micro pressure sensors of 50 mm size fabricated by a standard CMOS foundry and a novel post process”, IEEE International Conference on Micro Electro Mechanical Systems, Istanbul, Turkey, pp. 578-581, 22-26 Jan. (2006). (EI)
135
C.L. Dai, W.P. Shih, M.D. Wu, Y.M. Chang, M.J. Huang, “Residual stress in thin films measured by micromachined cantilever deflection and optical interferometer,” 10th Nano Engineering and Microsystem Technology Conference, Hsinchu, Taiwan, December (2006).
136
J. H. Chen, M. C. Liu, C. L. Dai, “A CMOS RF micromechanical switch”, 2006 Symposium on Nano Devices Technology, Hsinchu, Taiwan, April (2006).
137
戴慶良, 戴銚葦, “FET微壓力感測器,” 第23屆中國機械工程研討會,台南, Nov. (2006)
138
戴慶良, 林士傑, “應用於射頻之大調變範圍的微可變電容,” 第23屆中國機械工程研討會,Nov. (2006)
139
戴慶良, 陳富松, “大調變範圍的微機械可調式共振器”, 第十四屆全國自動化科技研討會, 彰化, Jun. (2006).
140
戴慶良, 陳俊翰, “低驅動電壓之微機電射頻開關”, 第十四屆全國自動化科技研討會, 彰化, Jun. (2006).
141
楊志偉, 戴慶良, “含電路的整合型壓力感測器”, 第十四屆全國自動化科技研討會, 彰化, Jun. (2006).
142
C. L. Dai, M. Liu, Y. Li, “A linearly tunable capacitor fabricated by the post-CMOS process,” Proceedings of SPIE, Vol. 5836, Sevilla, Spain (2005). (EI)
143
劉茂誠, 戴慶良, “以溶膠凝膠法氣體反應薄膜同時整合微機電結構與讀出電路”, 第九屆奈米工程暨微系統技術研討會, 台南, Dec. (2005).
144
喻韋強, 林忠逸, 戴慶良, “CMOS可調頻率為機械式共振器的設計與製作,” 2005年第三屆微電子技術發展與應用研討會, 高雄, May (2005).
145
翁祥益, 戴慶良, “整合溼度和溫度及電路之微感測器之製作,” 2005年機密機械製造技術研討會, 屏東, May (2005)
146
Y. C. Cheng, C. Y. Lee, W. J. Chen, C. L. Dai, P. Z. Chang, P. H. Chen, “Fabrication of the free space optical switch array using the CMOS process,” The 1 st International Symposium on Micro & Nano Technology, pp. I-2-01, Hawaii, USA (2004).
147
Y. C. Cheng, C. L. Dai, C. Y. Lee, P. Z. Chang, P. H. Chen, “Fabrication of MEMS mirror switches by the standard CMOS process,” Proc. Asia-Pacific Conf. Of Transducers and Micro-Nano Technology, PP. 945-950, Sapporo, Japan (2004).
148
Y. C. Cheng, C. Y. Lee, C. L. Dai, W. J. Chen, P. Z. Chang, P. H. Chen, “Fabrication of micro-optical switch by post-CMOS micromachining process,” SPIE International Symposium Photonic Europe－MEMS, MOEMS, and Micromachining, pp. 274-283, Strasbourg, France (2004). (EI)
149
彭宣榕, 許恒銘, 戴慶良, “相容於CMOS製程的微機電射頻開關之研製,” 第八屆奈米工程暨微系統技術研討會, 新竹, Dec. 2-3, (2004)
150
李裕仁, 劉茂誠, 戴慶良, “CMOS可變電容之設計與製作,” 第八屆奈米工程暨微系統技術研討會, 新竹, Dec. 2-3, (2004)
151
張原銘, 黃敏睿, 戴慶良, “薄膜楊氏係數及殘留應力之量測,” 第21屆中國機械工程研討會, pp.3125-3130, 高雄, Nov. (2004)
152
劉維虔, 張原銘, 戴慶良, “利用共振方法量測氮化矽和二氧化矽薄膜之楊氏係數和柏松比,” 第28屆中華民國力學會議, pp. 375-378, 台北, Dec. (2004)
153
戴慶良, 劉茂誠, “利用多晶矽串接結構與Seebeck effect製作感測器,”2004第十三屆全國自動化科技研討會, 台北, (2004)
154
戴慶良, 劉維虔, “利用共振方法量測薄膜機械性質,”2004第十三屆全國自動化科技研討會, 台北, (2004)
155
黃敏睿, 張原銘, 戴慶良, “氮化矽和二氧化矽薄膜機械性質之量測,”第二十七屆中國力學研討會, 高雄, (2003)
156
J. H. Chiou, C. L. Dai, J. Y. Chen, K. H. Yen, “ A novel fasting post-CMOS bulk micromachaniing technology with addition maskless etching,” ASME International Mechanical Engineering Congress & Exposition, Washington, v 5, p 97-100, USA, November 16-21, (2003) (EI)
157
J. H. Chiou, R. J. Lin, C. L. Dai, K. H. Yen, Y. C Shih, “ An actuator of controlling the area of dielectric layer by commercial CMOS fabrication,” ASME International Mechanical Engineering Congress & Exposition, Washington, v 5, p 623-627, USA, November 16-21, (2003) (EI)
158
C. Y. Lee, T. T. Wu, Y. Y. Chen, S. Y. Pao, W. J. Chen, C. L. Dai et. al, “In-situ monitoring of thickness of quartz membrane during batch chemical etching using a novel micromachined acoustic wave sensor,” Proceedings of the Annual IEEE International Frequency Control Symposium, p 993-1000, (2003). (EI)
159
C. L. Dai,C. H. Tsai,Y. R. Lee, Y. C. Cheng, “Improvement of substrate loss for micro inductors using the CMOS process and post-process,” 第七屆奈米工程暨微系統技術研討會, 台北, (2003)
160
C. L. Dai, Y. R. Lee, C. H. Tsai,Y. C. Cheng, “A variable capacitor with a lateral displacement microactuator,” 第七屆奈米工程暨微系統技術研討會, 台北, (2003)
161
Y. C. Cheng, C. Y. Lee W. J. Chen, C. L. Dai, P. Z. Chang, P. H. Chen, “ Design and fabrication of a free-space micro-optical bench based on CMOS-MEMS process,” 第二十屆機械工程研討會, pp. 73-79, 台北, (2003)
162
Y. C. Cheng, C. Y. Lee W. J. Chen, C. L. Dai, P. Z. Chang, P. H. Chen, “ 微型光通訊元件之設計與製作,” 第七屆奈米工程暨微系統技術研討會, pp. 171-174, 台北, (2003)
163
戴慶良, “CMOS微電感的設計和製作,” 2002奈米工程暨微系統技術研討會, 台南, (2002)
164
S. C. Chang, C. L. Dai, J. H. Chiou, P. Z. Chang, “Capacitive Micro Pressure Sensors with Underneath Readout Circuit Using a Standard CMOS Process,” Proceeding of SPIE, Vol. 4334, pp. 336-344, California, USA (2001).(EI)
165
戴慶良, 邱景宏, 顏凱翔, 陳立夫, “以靜電式微結構量測CMOS薄膜的楊氏係數”, 中華民國第二十五屆全國力學會議, 台中, pp. 925-932 (2001).
166
黃健生, 趙昌博, 陳立夫, 邱景宏, 戴慶良, “ CMOS微馬達的設計與製作”, 第十八屆中國機械工程學會全國學術研討會, 台北, pp. 115-120 (2001).
167
H. Chen, K. Yen, H. Huang, J. Chio, C. L. Dai, C. Chang, P. Chang, “ Fabrication of a Micromachined Optical Modulator Using the CMOS Process”, Proceeding of SPIE, Vol. 4078, pp. 620-626 (2000)
168
H. Chen, K. Yen, J. Chio, H. Huang, C. L. Dai, C. Chang, P. Chang, “Integrated Eyeball-tracking Device”, Proceeding of SPIE, Vol. 4078, pp. 637-645 (2000).
169
H. Chen, H. Huang, K. Yen, J. Chio, C. L. Dai, C. Chang, P. Chang, “ Fabrication of a Diffractive Optical Elements Using the CMOS Process”, Proceeding of SPIE, Vol. 4078, pp. 620-626 (2000)
170
戴慶良, 呂秀雄, 張培仁, “ CMOS微感測器和微致動器”,第一屆海峽兩岸製造技術研討會, 台北, pp. 61-69 (2000).
171
戴慶良, 陳炎洲, 吳明誠, “消除高轉速CD/DVD光碟機振動之研究”, 國科會八十九年度機械固力及熱流與能源學門成果研討會, 高雄(2000).
172
C. L. Dai, P. Z. Chang and C. Y. Chung, “ A CMOS capacitive pressure sensor - Design and fabrication,” International Fair and Congress For Sensors, Transducers & Systems, Germany, (1997).
173
C. L. Dai, P. Z. Chang, S. S. Lu, “ A pure CMOS surface micromachined pressure sensor,” International Conference on Precision Engineering, Taiwan, pp. 987-991(1997).
174
P. Z. Chang, C. L. Dai, S. S. Lu, “ Microstructures for measuring residual strains of CMOS thin films,” International Conference on Precision Engineering, Taiwan, pp. 981-986 (1997).
175
戴慶良, 張培仁, 黃暉雯, “ 以表面蝕刻及封口後製程製作電容式CMOS壓力計,” 第一屆微系統技術研討會, 新竹, (1997).
176
戴慶良, 張培仁, 張建六, “ 以微機電結構測試CMOS積體電路內各層薄膜殘留應變之研究,” 第一屆微系統技術研討會, 新竹, (1997).
177
C. L. Dai, P. Z. Chang, S. S. Lu, D. J. Wei and S. I. Liu, “ An integrated capacitive accelerometer using standard CMOS process,” International Electron Devices and Materials Symposia, Symposium C、E＆F, Taiwan, pp. 315-318 (1996).
178
C. C. Lai, L. J. Yang, P. Z. Chang, C. L. Dai, D. J. Wei and S. I. Liu, “ A piezoresistive pressure sensor fabricated by a commercial DPDM CMOS process,” International Electron Devices and Materials Symposia, Symposium C、E＆F, Taiwan, pp. 307-310, (1996).
179
戴慶良, 張培仁, “ 力學系統微型化 - 以積體電路技術製作微感測器之研究,” 中華民國第二十屆全國力學會議, 台北, pp. 544-551 (1996).
